| 摘要 |
PROBLEM TO BE SOLVED: To provide the subject adhesive where an additive for raising the adhesive strength the resultant cured product is homogeneously dispersed in a thermosetting epoxy resin, also suppressed in foam generation at its thermocompression bonding temperature. SOLUTION: This adhesive essentially comprises (A) a thermosetting epoxy resin and (B) a terminal epoxy-modified siloxane oligomer at 0.01-10 wt.% based on the component A; wherein the average polymerization degree of the siloxane chain of the oligomer B is <=16. This adhesive is intended for application in mounting bare chips on a substrate through thermocompression bonding.
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