发明名称 |
A method of manufacturing a circuit element |
摘要 |
The present invention provides a method of manufacturing a circuit element which includes a step of performing first exposure for transferring a pattern having a narrowed portion for forming a particular pattern, onto an exposure-target substrate, and a step of moving the pattern in a direction not parallel to a segment forming an outer circumference of the narrowed portion and performing second exposure for transferring the pattern onto the exposure-target substrate.
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申请公布号 |
US6248508(B1) |
申请公布日期 |
2001.06.19 |
申请号 |
US19980042653 |
申请日期 |
1998.03.17 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MUROOKA KEN-ICHI;HIGURASHI HITOSHI |
分类号 |
H01L29/06;G03F7/20;H01L21/027;H01L29/66;(IPC1-7):G03F7/22 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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