发明名称 METHOD OF AND DEVICE FOR CUTTING ADHESIVE TAPE USED FOR SUBSTRATE OR SHEET SURFACE WASHING DEVICE
摘要 PROBLEM TO BE SOLVED: To completely remove an adhesive lump, etc., produced by cutting a used adhesive tape of an adhesive tape to be used for a substrate or sheet surface washing device to prevent attachment of the adhesive lump to a substrate or a sheet and to certainly, smoothly and speedily carry out its work. SOLUTION: It is possible to prevent attachment of an adhesive lump to a substrate or a sheet by use of a renewed adhesive tape as formation of the adhesive lump, etc., formed at the time of cutting an adhesive constituting an adhesive tape is restrained and the formed one is also adsorbed on a removal tape by adhering the removal tape 6 having weak stickness or no stickness along a cutting scheduled part 5 on the side of the adhesive 3 of the cutting scheduled part 5 of the adhesive tape 1 and peeling the removal tape 6 after cutting the cutting scheduled part 5 with the removal tape 6.
申请公布号 JP2001162580(A) 申请公布日期 2001.06.19
申请号 JP19990345966 申请日期 1999.12.06
申请人 REYOON KOGYO:KK 发明人 SHIRAHAMA ICHIRO;EKOSHI KENTARO
分类号 B26D1/02;(IPC1-7):B26D1/02 主分类号 B26D1/02
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