| 摘要 |
A method of preparing a laminated packaging material, comprising forming an extruded coating layer of a thermoadhesive resin on a thin-film layer provided on a substrate, said thin-film layer comprising an inorganic or metal compound and having gas barrier properties. The thin-film layer is laminated thereon with a heat buffer layer in such a way that the substrate may substantially undergo no expansion and constriction, e.g., by dry lamination or non-solvent lamination. Then the extruded coating layer is formed on the heat buffer layer, after an anchor coat layer has been optionally formed on the heat buffer layer. Such a heat buffer layer is preferably selected from the group consisting of a polyester film, a polyethylene film, a polypropylene film and a polyamide film.
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