| 摘要 |
PROBLEM TO BE SOLVED: To provide a brazing apparatus to reliably achieve the brazing on an entire surface of a substrate without allowing any brazing filler metal to be splashed on an upper surface of the substrate. SOLUTION: Before the substrate W is placed above a spray hole 44 of a second nozzle 16, the output of a second electromagnetic induction pump 6 is minimized to prevent a solder S from being splashed on the upper surface of the substrate W, and the wave height of the secondary jet wave is reduced, the speed is increased and the flow-down angle is also increased. When the solder S is brought into contact with a tip of a lower surface of the substrate W, the wetting of the rear solder is reliably advanced, and the solder S is excellently separated while the output of the second electromagnetic induction pump 6 is left unchanged, and the flow-down angle is increased at the intermediate height.
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