| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition excellent in dispersibility, drying properties and environmental safety and providing a fine pattern excellent in developability, photosensitivity, adhesion, pencil hardness, solvent, acid, heat and gold plating resistances. SOLUTION: This photosensitive resin composition comprises a mixed solvent (E) composed of a dialkyl glutarate, a dialkyl succinate and a dialkyl adipate in the photosensitive resin composition in the photosensitive resin composition used when producing electronic circuit boards. |
