发明名称 POLYIMIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a polyimide film having little dimensional change after sticking in a flexible copper sticking and/or flexible print circuit laminated film. SOLUTION: A polyimide film having <=0.07% heat shrinkage of the film and <=7 mm elongation value in one side is claimed.
申请公布号 JP2001164006(A) 申请公布日期 2001.06.19
申请号 JP19990349594 申请日期 1999.12.09
申请人 DU PONT TORAY CO LTD 发明人 NISHIYA YOSHITAKA;OKABASHI MASAKAZU;KUBO MICHIHIRO
分类号 C08J5/18;B32B15/08;B32B15/088;(IPC1-7):C08J5/18 主分类号 C08J5/18
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