发明名称 |
POLISHING DEVICE AND POLISHING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To polish a high-precision workpiece requiring low-pressure machining by regulating the pressure of slurry supplied between an upper and a lower surface plate. SOLUTION: A movable slurry ring 24 with a reentrant 25, which can be filled with slurry 30, is disposed for vertical positioning over an upper surface plate 11 with a plurality of supply holes 14 passing therethrough between the top and bottom surfaces, and the reentrant 25 of the movable slurry ring 24 and the supply holes 14 of the upper surface plate 11 are interconnected via tubes 29. The slurry 30 from a slurry supply source is once reduced in pressure in the reentrant 25 of the movable slurry ring 24, before being supplied between the upper surface plate 11 and a lower surface plate 1 by way of the tubes 29 and the supply holes 14 of the upper surface plate 11.</p> |
申请公布号 |
JP2001162518(A) |
申请公布日期 |
2001.06.19 |
申请号 |
JP19990346335 |
申请日期 |
1999.12.06 |
申请人 |
SPEEDFAM CO LTD;ASAHI GLASS CO LTD |
发明人 |
YASHIKI HIROSHI;MOMOSE TORU |
分类号 |
B24B37/00;(IPC1-7):B24B37/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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