| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to increase the testing efficiency by simultaneously making a plurality of testings in one time contact doing no damage to terminal pads in a semiconductor integrated circuit in order to test the wafer status in the circuit wherein the pin numbers required by the testing items are notably differentiated. SOLUTION: An integrated circuit tester equipped with a prober 5 composed of a tester and a probe composed corresponding to an integrated circuit on a wafer and a transmitting means of signals between the tester and the prober 5 also a testing board 4 quick disconnectably inserted between the wafer and the prober 5 as well as a connector 41 arranged corresponding to the wafer pads on the surface of the - side of the testing board 4 simultaneously pads 42 arranged corresponding to the other side surface of the testing board 4 furthermore, the connectors 41 of the testing board 4 and the pads 42 are wired pertinent to the testing of the integrated circuit inside the testing board 4. |
