发明名称 Electroplating apparatus
摘要 An electroplating apparatus including an elongated, hollow conductive anode tube having first and second ends, an inner conductive surface, and an outer conductive surface from which sacrificial plating metal may be suspended. An elongated cathode conductor is disposed within the hollow conductive anode tube, the cathode conductor having first and second ends, corresponding to the first and second ends of the anode tube, and an outer conductive surface. An insulation layer is placed between the outer surface of the cathode conductor and the inner surface of the anode tube. Power and ground cables respectively connect a power supply to the first end of the anode tube and the first end of the cathode conductor, and a conductive jumper connects the second end of the cathode conductor to an elongated cathode bar, from which articles to be plated may be suspended. By placing the cathode conductor within the anode tube, the far end of the cathode can be connected to the power supply without the need to string cables for the length of the plating tank, and the co-axial relationship of the cathode conductor within the anode tube reduces inductance within the system over this portion of the electrical distribution system.
申请公布号 AU4512001(A) 申请公布日期 2001.06.18
申请号 AU20010045120 申请日期 2000.11.30
申请人 NELSON SOLID TEMP, INC. 发明人 GLENN M. NELSON;TADEUSZ MASLACH
分类号 C25D17/12;H05K3/24 主分类号 C25D17/12
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