| 摘要 |
PROBLEM TO BE SOLVED: To accelerate the plating rate in a contact plating method and to improve the plating efficiency by remarkably increasing the contact area between an object to be plated functioning as a cathode and a metal functioning as an anode. SOLUTION: In this contact plating method of a system in which the object to be plated made of a metal is dipped into a solution containing a compound of a first metal to be precipitated, the object to be plated is brought into contact with a second metal baser than the object to be plated in the same solution, and, with the second metal as an anode, and the object to be plated as a cathode, the first metal is precipitated on the object to be plated, as the second metal, a granular metal is adopted, and the granular metal is dispersed into a floating state in the solution and is thereby brought into contact with the object to be plated, by which the contact area with the object to be plated is increased.
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