发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a useful resin composition particularly for an epoxy resin curing agent which is in a liquid state at an ordinary temperature and has a high curing speed when it is used, the resulting cured product having excellent water resistance and chemical resistance. SOLUTION: In the resin composition comprising 2,5- and/or 2,6-diaminomethyl bicyclo [2.2.1] heptane as an essential component, the composition comprises mixing the 2,5- and/or 2,6-diaminomethyl bicyclo [2.2.1] heptane with an amine compound other than the abovementioned compounds, and containing various modified polyamines.
申请公布号 JP2001163954(A) 申请公布日期 2001.06.19
申请号 JP19990346259 申请日期 1999.12.06
申请人 MITSUI CHEMICALS INC 发明人 SHIMIZU TAKUJI;OGATA HIDEAKI
分类号 C08G59/50;(IPC1-7):C08G59/50 主分类号 C08G59/50
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