| 摘要 |
<p>PURPOSE: A laser pierce processing device is provided to make multiple holes on a printed substrate and an IC package at once by combining a laser, a diffraction type optical part which includes an identical repetitive pattern of a constant spacing period and the modulated repetitive pattern and diffracts the laser lights so as to generate multiple beams, and an fsinθlens for condensing multiple branching beams. CONSTITUTION: A parallel incident laser beam(1) from a laser is divided into diffraction beams(13) having two-dimensional expansion by a diffraction type optical part(DOE)(8). The diffraction beam(13) is formed into a light condensing divided beam(17) by a light condensing(fsinθ) lens(14), and radiated to a package(15) so as to make multiple holes(16) at once. Plural different diffraction type optical parts are manufactured and mounted to a rotary disc, and the disc is rotated, so that the diffraction type optical part can be spontaneously exchanged. If a hybrid system in combination of a galvano mirror and the diffraction type optical part is adopted, wide range degree of freedom is acquired for dealing with any hole arrangement.</p> |
