APPARATUS AND METHOD FOR SEPARATING WAFER

摘要

PURPOSE: A method for separating a wafer is provided to prevent damage to a semiconductor chip in separating the wafer into individual semiconductor chips, by using a diamond blade. CONSTITUTION: A wafer(100) is prepared. A part of the thickness of the wafer is sawed along a separation line of the wafer by the first width to form the first groove(128). The second groove(138) has the second width narrower than the first width, extending from the first groove to a thickness direction of the wafer. The third groove(148) has the third width narrower than the second width, extending from the second groove to the thickness direction of the wafer.