DIE-BONDING DEVICE AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: To eliminate generation of a void due to the involved air and excessive junction material when using a resin film as the junction material when joining a lead frame to a semiconductor chip. CONSTITUTION: A stripe-shaped lamination resin film 4 with the same width dimension as that of a semiconductor chip 2 is cut from a lamination resin film 4, and is joined onto a specific region 1R of a lead frame 1 by heating to a temperature lower than the transition temperature of a resin ribbon 4b for pressurization. Then, after a non-adhesive cover ribbon 4a is eliminated from the film 4, the semiconductor chip 2 is boned via an adhesive resin ribbon 4b being heated to the temperature before or after the transition temperature and is further pressurized.