| 摘要 |
PURPOSE: To uniformly coat a resist film by spraying and coating a conductivity imparting agent onto the surface and/or the rear surface of a plate-shaped material to be coated to form an undried conductivity imparting film having a volume resistivity of a specified value or below and then electrostatically coating a liquid resist onto the coated surface or un-coated surface. CONSTITUTION: While a plate-shaped material 1 to be coated such as a printed circuit board vertically suspended is continuously conveyed, a conductivity imparting agent is sprayed and applied onto the surface and/or the rear surface thereof by utilizing a spraying device 7 to form an un-dried conductivity imparting film having <= 5x106 Ω.cm volume resistivity. At this time, for example, a conductive solvent alone or a solution or dispersion of a resin for resist dissolved or dispersed in the conductive solvent is used as the conductivity imparting agent. Then, the liquid resist is electrostatically coated onto the coated surface or un-coated surface of the plate-shaped material 1 to be coated by utilizing an atomizing device 5. Thereby, a resist film can be uniformly coated on the plate-shaped material 1 to be coated thin in the plate thickness.
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