| 摘要 |
PURPOSE: An apparatus for etching a wafer for manufacturing a semiconductor device is provided to improve repeatability in an etching process, by preventing plasma density from being decreased by a conductive thin film formed on the lower surface of a dielectric window. CONSTITUTION: A conductive chamber(1) has a space part where plasma is generated. A dielectric window(2) of a quartz or ceramic material is installed in the upper portion of the conductive chamber. An antenna(3) is installed in the upper portion of the dielectric window. A wafer chuck(4) is installed in the conductive chamber. A shower head(6) having a plurality of gas apertures is installed in the lower portion of the dielectric window.
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