| 摘要 |
PURPOSE: Provided is a connecting material having high heat-resistance, which can avoid occurrence of faulty electric conductance even at high temperature and high humidity in the case of bonding narrow intervals of electrodes. CONSTITUTION: The connecting material comprises 20-75wt% of a thermosetting resin, 25-80wt% of an inorganic filler, and 0-40wt% of a thermoplastic resin. The connecting material has an elasticity of 1-12GPa after curing, a glass transition temperature(Tg) of 120-200deg.C, a coefficient of linear expansion (alpha 1) being 50ppm/deg.C or less at a temperature below the Tg and a coefficient of linear expansion (alpha 2) being 110ppm/deg.C or less at a temperature above the Tg, wherein the difference(alpha 2-alpha 1) is less than 60ppm/deg.C.
|
