METHOD FOR CHUCKING WAFER IN SEMICONDUCTOR PROCESS

摘要

PURPOSE: A method for chucking a wafer in a semiconductor process is provided to install a wafer, preventing the warpage of a wafer arisen from the stress ununiformity of useless films in the front of a wafer, in a processing chamber. CONSTITUTION: A semiconductor exposure system comprises a case having slots where the aperture is placed, the first moving member for moving the case in order to position the aperture selected among the apertures in the loading position, and the second moving member taking out the selected aperture placed in the loading position in the case moved by the first moving member from the slot and moving the aperture in a setting position of light path.