| 摘要 |
The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode (8), is replicated on an electrically conductive material, a substrate (9). The master electrode (8) is put in close contact with the substrate (9) and the etching/plating pattern is directly transferred onto the substrate (9) by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells (12,14), that are formed in closed or open cavities between the master electrode (8) and the substrate (9). |
