SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor package is provided to prevent chemical vapor generated in hardening a sealing member from being induced to a chip mounting space, by forming the sealing member along the circumference of a glass cover separated from the chip mounting space. CONSTITUTION: A package body(110) has a chip mounting space, which is dented toward the inside of a surface of the package body. A semiconductor chip(130) is mounted on the bottom surface of the chip mounting space. Pluralities of inner leads are formed in the outside of the bottom surface of the chip mounting space where the semiconductor chip is mounted. A fine metal wire electrically connects the inner leads with the semiconductor chip. Outer leads are protruded toward the outer surface of the package body, formed as one body with the inner lead. A glass cover(150) covers the chip mounting space, closely adhered to a surface of the package body. A sealing member(160) seals the chip mounting space with the glass cover, formed along the circumference of the glass cover adhered to the surface of the package body.