EQUIPMENT FOR ASSEMBLING HEAT SINK TO SEMICONDUCTOR MODULE AND ASSEMBLING METHOD THEREOF

摘要

PURPOSE: An equipment and a method for assembling a heat sink to a semiconductor module are to accomplish a strong engagement of the heat sink to the module and to continuously assemble the heat sink to the module. CONSTITUTION: An assembling pad feeding device(200) of square frame shape is arranged at a center of top surface of a base body(100). The first heat sink supplying device(300) is arranged around a center of the pad feeding device. A rivet machine(600) is arranged above the pad feeding device with a distance from the second heat sink supplying device(500). A label sticker(700) is placed within the pad feeding device spaced from the rivet machine along the pad feeding device and curved in a X-direction. A visual testing unit(800) is arranged at a distance from the label sticker. A semiconductor product loading device(900) is arranged within the base body with a distance from the visual test unit. The pad feeding device comprises an assembling pad(210), a feeding body(220) and a feeding cylinder(230) for feeding the assembling pad.