发明名称 RAPID THERMAL PROCESSING APPARATUS
摘要 PURPOSE: A rapid thermal processing apparatus is provided to easily replace a lamp by exchanging the lamps by a single module unit, and to improve temperature uniformity by reducing change of temperature distribution according to a structural error generated in the exchange process. CONSTITUTION: A rapid thermal processing apparatus includes a process chamber, a wafer supporting unit, a heating unit and a power controller. The heating unit includes a plurality of single modules in which both ends of a plurality of bar-type infrared lamps(40) are fixed in two fixing units(147') vertical to the infrared lamps. The fixing unit has a plurality of electrodes(148') and an insulator for insulating the surface of the fixing units. The electrodes are electrically connected to ends of the infrared lamps by one-to-one correspondence to the infrared lamps. External power is distributed and applied to the electrodes.
申请公布号 KR20010047141(A) 申请公布日期 2001.06.15
申请号 KR19990051224 申请日期 1999.11.18
申请人 KORNIC SYSTEMS CORP. 发明人 JUNG, GWANG IL
分类号 H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/324
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