| 摘要 |
PURPOSE: An infrared detector is provided to improve bonding reliability by guaranteeing equilibrium of flip-chip bonded substrates, and to improve tolerance of a hybrid chip regarding thermal stress by maintaining a minimum interval between the flip-chip bonded substrates. CONSTITUTION: An infrared detecting device is disposed in the first substrate(10) having the first bump array part where the first bumps are disposed. A read-out circuit for processing and outputting a signal from the infrared detecting device is formed in the second substrate(20) having the second bump array part where the second bumps are disposed. The second bumps are bonded to the second substrate. The first and second stoppers(13,23) are respectively formed along the outer edge of the first and second bump array parts to make an interval between the first and second substrates have a constant height, contacting each other. |
