POLISHING APPARATUS AND METHOD OF POLISHING MATERIAL TO BE POLISHED

摘要

PURPOSE: A polishing apparatus is provided to satisfactorily polish a material to be polished under a plurality of polishing conditions. CONSTITUTION: Polishing stations for polishing a wafer(W) to be polished, and cleaning stations for cleaning the wafer(W) are arranged alternately in a substantially circular configuration around an arm rotating shaft (rotary shaft) of an arm(4) for transferring the wafer(W) from each polishing station to each cleaning station. Each of the station includes a holding seat that places the wafer(W) thereon and is movable toward a holding head(5) of the arm(4), and a cleaning unit for cleaning the wafer(W) and the lower portion of the head(5). The unit includes a cleaning roller (cleaning member), and a cleaning member drive unit that causes the roller to advance between the head(5) and the seat.