SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND TESTING METHOD

摘要

PURPOSE: To easily form an alignment mark that can be recognized by an existing wafer prober for a semiconductor device, that has a plurality of semiconductor elements being arranged for sealing and is positioned by image recognition for testing, its trial manufacturing method, and its testing method. CONSTITUTION: A rewiring layer 18 for connecting the electrode of a semiconductor chip 14 to an electrode pad, arranged at a specific position, is formed on a semiconductor chip 14. A metal post 16, where a solder ball 22 is to be formed, is formed on the electrode pad of the rewiring layer. On the rewiring 18, a mark member 24 is formed, where the mark member 24 provides an alignment mark arranged in a prescribed position relationship with the metal post 16. The mark member 24 is formed by the same materials quality as that of the metal post 16.