| 摘要 |
PURPOSE: A laser cutting equipment and a method for cutting using the same are provided which minimize defective cutting by preventing cells of base plates from getting out of the cutting line when the base plates are turned over and also prevent the base plates from chipping and cracking when the mother base plates are turned over. CONSTITUTION: The laser cutting equipment comprises: (i) a laser cutter(100) which comprises a heating device(110) heating a cutting line of a first base plate and a second plate by launching a laser beam, and a cooling device cooling the cutting line to be cut to induce crack on the cutting line; (ii) a turn/over device(200) which is installed on the lower part of the laser cutter and turns over the position of the first and the second base plates and comprises a work stage(210), a fixing chuck(230), a turn-over chuck(250) and a vacuum-forming device. The method comprises steps of: (i) putting the first base plate and the second base plate, which are adhered to each other, on the upper side of the work stage and generating a vacuum pressure to the work stage to absorb the second base plate and then after applying high temperature laser beam along the cutting line of the first base plate, cutting cells from the first base plate by spraying the cooling fluid thereto; (ii) positioning the fixing chuck on the upper side of the first base plate and vacuum-absorbing the first base plate to prevent the cells from getting out of the cutting line; (iii) after positioning the turn-over chuck on the upper side of the fixing chuck, vacuum-absorbing the fixing chuck and after releasing the vacuum of the work stage, rotating the first and second plates at 180 degree to position the fixing chuck and the work stage to face each other and also position the second base plate and the laser cutter to face each other; (iv) after releasing the vacuum of the turn-over check, taking the turn-over chuck out of between the fixing chuck and the work stage; and (v) fixing the fixing chuck on the work stage by generating the vacuum on the upper side of the work stage and then after applying high temperature laser beam along the cutting line of the second base plate, cutting cells from the second base plate by spraying the cooling fluid thereto.
|
