发明名称 SYSTEMS AND METHODS FOR APPLICATION OF ATMOSPHERIC PLASMA SURFACE TREATMENT TO VARIOUS ELECTRONIC COMPONENT PACKAGING AND ASSEMBLY METHODS
摘要 <p>This invention is related to a method for effecting metallic bond region modification in electronic components comprising metallic bond regions, the method comprising the steps of: transporting an electronic component having at least one metallic bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5 x 105 Pa to about 3.0 x 105 Pa, thereby forming a treated electronic component.</p>
申请公布号 WO2001041963(A2) 申请公布日期 2001.06.14
申请号 US2000042454 申请日期 2000.12.01
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