发明名称 HEAT-RELAXABLE SUBSTRATES AND ARRAYS
摘要 <p>Articles (10, 110, 210, 310, 410, 510, 610), such as high density arrays, on heat-relaxable substrates (20, 120, 220, 320, 420, 520, 620) that can be relaxed by exposure to thermal energy are disclosed, along with methods of manufacturing the arrays, and systems/apparatus (80, 180) for relaxing arrays using electromagnetic energy. The arrays may themselves include electromagnetic energy sensitive material (30 130, 232, 330, 430, 53, 630) in their construction, in which case exposure of the arrays to suitable electromagnetic energy can provide the thermal energy required to cause the arrays to relax. In other embodiments, the arrays may not include an electromagnetic energy sensitive material in their construction, in which case the arrays may be heated indirectly, i.e., by locating the arrays within a system or apparatus that includes an electromagnetic energy sensitive material and transferring the thermal energy from the electromagnetic energy sensitive material to the array by, e.g., conduction.</p>
申请公布号 WO2001041917(A1) 申请公布日期 2001.06.14
申请号 US2000032949 申请日期 2000.12.04
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