| 摘要 |
<p>A mold release film for sealing a semiconductor, which does not deform the terminals of a semiconductor nor a mold release film during a semiconductor element sealing process, and is excellent in mold release performance, and a sealing method for a semiconductor element using the film and capable of increasing a semiconductor production efficiency. A mold release film for sealing a semiconductor element, consisting of a single layer or multiple layers containing thermoplastic resin, and satisfying the following requirements, and a sealing method for a semiconductor element using the mold release film. (1) A wetting index on the front surface layer is up to 36, (2) a heat shrinkage at 175°C is less than 3%, (3) a modulus of elasticity at 175°C is 10-500 MPa, and (4) a mold release film is 10-300 νm thick.</p> |
