| 发明名称 |
METHODS FOR PRODUCING PACKAGED INTEGRATED CIRCUIT DEVICES & PACKAGED INTEGRATED CIRCUIT DEVICES PRODUCED THEREBY |
| 摘要 |
This invention discloses a crystalline substrate based device including a crystalline substrate (102) having formed thereon a microstructure (100); an d at least one packaging layer (106) which is sealed over the microstructure b y means of an adhesive and defines therewith at least one gap between the crystalline substrate (102) and the at least one packaging layer (106). A method of producing a crystalline substrate based device is also disclosed.< /SDOAB> |
| 申请公布号 |
CA2394458(A1) |
申请公布日期 |
2001.06.14 |
| 申请号 |
CA20002394458 |
申请日期 |
2000.11.26 |
| 申请人 |
SHELLCASE LTD. |
发明人 |
BADEHI, AVNER PIERRE |
| 分类号 |
H01L23/02;B81B7/00;H01L21/50;H01L23/10;H01L27/146;H03H3/02;H03H9/10;(IPC1-7):H01L21/44;H01L23/06;H01L23/12;H01L29/40;H01L21/48;H01L23/48;H01L23/52 |
主分类号 |
H01L23/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
