申请人 |
QUALCOMM INCORPORATED;JACOBS, PAUL, E.;ANTONIO, FRANKLIN, P.;DORNER, STEVEN;NOERENBERG, JOHN, W.;BELK, JEFFREY, K.;OGDON, BENJAMIN, P.;BECKLEY, JEFFREY, D.;BIRD, ALAN;BOYD, JOHN, D.;PURLIA, JOHN, S.;RHODES, WILLIAM, J.;ROSS, DAVID, J.;DUDZIAK, MATTHEW, J. |
发明人 |
JACOBS, PAUL, E.;ANTONIO, FRANKLIN, P.;DORNER, STEVEN;NOERENBERG, JOHN, W.;BELK, JEFFREY, K.;OGDON, BENJAMIN, P.;BECKLEY, JEFFREY, D.;BIRD, ALAN;BOYD, JOHN, D.;PURLIA, JOHN, S.;RHODES, WILLIAM, J.;ROSS, DAVID, J.;DUDZIAK, MATTHEW, J. |