METHOD AND APPARATUS FOR COMBINED ALIGNMENT AND HEAT DRAIN OF STACKED PROCESSING STAGES

摘要

A method and apparatus for cooling and simultaneously aligning processing devices consisting of stacked processing stages (PS). The invention utilizes heat drain profiles (5a-d) that are held in position and parallel orientation by a heat sink base (1). The heat drain profiles (5a-d) protrude through soldering holes (14) of each processing stage. The soldering holes (14) have a heat bridge characteristic (HTC) defined mainly by their surface material, their surface area, and their fitting precision. The heat drain profiles (5a-d) are of number, size and material such that they drain a minimal thermal energy at the lowest temperature difference between heat sink base (1) and PS for a given HTC. The minimal thermal energy is higher than the maximum thermal energy created within a PS.