| 摘要 |
PURPOSE: A wafer probing socket is provided to minimize limitation by the location of a pad in designing a die, by sequentially combining a blade tip body and a spacer plate body in a base pin. CONSTITUTION: Two base pin holes are formed in a main body. Upper and lower portion buffer units(2,3) are formed as one body in a blade tip body(5), bent in opposite directions on the upper and lower surfaces of the main body. A hole located in the same line as the base pin hole formed in the blade tip body is formed in a spacer plate body(10), and an insulating material is applied on both surfaces of the spacer plate body. Base pins(15) are sequentially inserted and coupled by using base pin holes formed in the blade tip body and the spacer plate body.
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