发明名称 |
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste |
摘要 |
Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.
|
申请公布号 |
US2001003362(A1) |
申请公布日期 |
2001.06.14 |
申请号 |
US20000741024 |
申请日期 |
2000.12.21 |
申请人 |
DOW A MINING CO., LTD. |
发明人 |
SANO KAZUSHI;OKADA YOSHIHIRO;MIYOSHI HIROMASA;TAKADA YOSHIOMI |
分类号 |
B22F1/00;B22F9/24;C09D5/24;H01B1/02;H01C7/02;H05K1/09;(IPC1-7):H01B1/02;B22F1/02;C22C1/05;H01C1/00 |
主分类号 |
B22F1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|