发明名称 Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
摘要 Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.
申请公布号 US2001003362(A1) 申请公布日期 2001.06.14
申请号 US20000741024 申请日期 2000.12.21
申请人 DOW A MINING CO., LTD. 发明人 SANO KAZUSHI;OKADA YOSHIHIRO;MIYOSHI HIROMASA;TAKADA YOSHIOMI
分类号 B22F1/00;B22F9/24;C09D5/24;H01B1/02;H01C7/02;H05K1/09;(IPC1-7):H01B1/02;B22F1/02;C22C1/05;H01C1/00 主分类号 B22F1/00
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