| 摘要 |
The method of manufacturing molded semiconductor devices uses a molding machine including an upper die (20) and a lower die (21), in one of which are formed a plurality of cavities (26) each positioned to receive therein at least one semiconductor device to be molded. The method comprises the steps of covering inner faces of the cavities (26) and a parting face of one of the dies (20,21), which contacts a substrate (12) carrying the semiconductor devices (10), with release film (40), which is easily peelable from the dies (20,21) and from the resin (34a) used for molding, clamping the substrate (12) between the dies (20,21), filling the cavities (26) with resin (34a), and forming the semiconductor devices by cutting the molded substrate (12). <IMAGE> |
