发明名称 |
MONITORING SYSTEM FOR DICING SAWS |
摘要 |
A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a sensor for determining a speed of a blade of the dicing saw. A monitor determines a load placed on the blade by the substrate, where the monitor measures at least one of a feedback control current and a feedback control voltage output from the dicing saw. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.
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申请公布号 |
WO0141959(A2) |
申请公布日期 |
2001.06.14 |
申请号 |
WO2000US42401 |
申请日期 |
2000.11.30 |
申请人 |
KULICKE & SOFFA INVESTMENTS, INC. |
发明人 |
WEISSHAUS, ILAN;LICHT, ODED, YEHOSHUA |
分类号 |
H01L21/301;B23D5/02;B23D59/00;B23Q15/08;B23Q15/12;B28D5/00;G05B19/4065;H01L21/00;(IPC1-7):B23D59/00 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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