| 摘要 |
A multiple line grid(MLG) for use in a multiple line grid array(MLGA) packaging incorporates therein circuit elements, e.g., metal lines, resistors, capacitors, inductors, transistors or combinations thereof, with a view to reducing a size of a printed circuit board on which it is mounted. The MLGA package includes a semifinished package including a surface with a first metal pattern formed thereon for connecting a number of input/output terminals, a printed circuit board(PCB) including a top surface with a second metal pattern formed thereon according to the first metal pattern; and at least of a MLG which is disposed between the semifinished package and the PCB. The MLG includes a non conductive body incorporated therein a plurality of circuit elements and multiple number of conductors in the form of a column. Each of the conductors is electrically isolated from each other and is electrically connected to the first and the second metal patterns. <IMAGE> |
