发明名称 LEAD-FREE SOLDER
摘要 <p>A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400 DEG C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.</p>
申请公布号 EP1106301(A1) 申请公布日期 2001.06.13
申请号 EP20000931692 申请日期 2000.06.05
申请人 NIPPON SHEET GLASS CO., LTD. 发明人 DOMI, SHINJIRO;SAKAGUCHI, KOICHI;NAKAGAKI, SHIGEKI;SUGANUMA, KATSUAKI
分类号 B23K35/26;C22C13/00;C22C13/02;(IPC1-7):B23K35/26 主分类号 B23K35/26
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