LEAD-FREE SOLDER,申请号EP19980916647-传众专利搜索

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发明名称	LEAD-FREE SOLDER
摘要	<p>A lead-free solder composition comprising: 20 to 30 wt. % bismuth, 1.0 to 3.0 wt. % silver, 0.01 to 2.0 wt. % copper, 0.01 to 4.0 wt. % antimony and incidental impurities, the balance being tin.</p>
申请公布号	EP0977900(A4)	申请公布日期	2001.06.13
申请号	EP19980916647	申请日期	1998.04.22
申请人	ECOSOLDER INTERNATIONAL PTY LIMITED	发明人	WALTON, IAN, NOEL
分类号	B23K35/26;C22C13/02;H05K3/34;(IPC1-7):C22C13/02	主分类号	B23K35/26
代理机构		代理人
主权项
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