| 摘要 |
A stacked package structure of an image sensor for electrically connecting to a printed circuit board (20) includes substrate (10), integrated circuit (22), image sensing chip (26) and transparent layer (32). The substrate (10) has first surface (12) formed with signal input terminals (16) and second surface (14) formed with signal output terminals (18) for electrical connection to the printed circuit board (20). The integrated circuit (22) is mounted on the first surface (12) of the substrate (10) and is connected to the signal input terminals (16). The image sensing chip (26) is located above the integrated circuit (22) to form a stacked structure for connection with the signal input terminals (16). A spacer (28) may be provided between the integrated circuit (22) and the image sensing chip (26) to form gap (30). The transparent layer (32) is arranged above the image sensing chip (26) enabling the image sensing chip (26) to receive signals. |
