发明名称 |
Method of producing semiconductor device with heat dissipation metal layer and metal projections |
摘要 |
A method of producing a semiconductor device having a heat dissipating metal layer wherein the number of patterning steps is reduced, laser dicing produces a better profile, and first and second metal layers are prevented from separating from each other, and a semiconductor device produced by the method. The number of patterning steps is reduced by employing a flat exposure step for photoresist with mask alignment. A better appearance is obtained by forming the metal layers which connect the semiconductor devices with each other from a first metal layer having a lower melting point and a second metal layer having a higher melting point and severing the first metal layer and the second metal layer successively, from the first metal layer side. A second metal layer is prevented from peeling by preventing oxidation of the plated feeder layer through plating of the second metal layer.
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申请公布号 |
US6245596(B1) |
申请公布日期 |
2001.06.12 |
申请号 |
US19990427584 |
申请日期 |
1999.10.27 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KOSAKI KATSUYA;TAMAKI MASAHIRO;MATSUOKA HIROSHI |
分类号 |
B23K26/00;B23K26/40;H01L21/301;H01L21/304;H01L21/78;H01L23/367;(IPC1-7):H01L23/24 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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