SUBSTRATE FOR MOUNTING SEMICONDUCTOR DEVICE AND PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To send and receive a high frequency signal reducing a transmission loss by preventing the characteristic impedance of a transmission path of a passing through conductor that connects an electrode pad and a semiconductor device from varying from a predetermined value (50Ω) due to the generation of unnecessary capacitance between an inner layer ground conductor and the electrode pad in an insulating substrate. SOLUTION: When the diameter of an almost circular electrode pad 10 is (w) and the spacing between the electrode pad 10 and internal layer ground conductors 22, 23 in the direction parallel to the primary plane of a substrate 1 is (d), the relation 0