| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to narrow the width of semiconductor chips to be chucked to increase the yield rate of products in which the semiconductor chips are mounted and to reduce the cost in addition. SOLUTION: In a collet 10A, a sucking hole 11A whose center line is its eccentric axis BX is formed. The tapering part 20 of the collet 10A is in a shape formed by cutting a truncated cone with a plane passing its center, and a specular surface 21 is formed on this cut surface. The specular surface 21 is a ground metal surface or evaporated metal surface. The side surface of the collet 10A is cut obliquely and a semiellipsoidal surface 22 is formed, so that the specular surface 21 may not be hidden, when the specular surface 21 is looked down obliquely from above, and the upper side of the specular surface 21 coincides with the straight line of the semiellipsoidal surface 22. Since the surface 21 does not form a shade on alignment marks 16A and 17A, the angle between the generating line of the tapering part 20 and the axis BX is made larger and the specular surface 21 is widened.</p> |
