发明名称 |
Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrate |
摘要 |
The primary objective of the present invention is to select a connecting combination of the plurality of solder ball connection pads and the plurality of wire bond pads, and generate an optimum wiring candidate. For this objective, the wiring pattern generation unit generates a wiring pattern as the information for specifying an in-area wiring route to be wired in each row and an in-area wiring route to be connected to the next row among the solder ball connection pad area closer to the wire bond pad area, based on the design conditions of the wiring route stored in the design condition memory. Then, the wiring plan generation unit generates a wiring plan laying out the plurality of wiring routes by combining the wiring patterns generated for each row, and the wiring rule check unit selects some of the generated wiring plans suited for the wiring rules and generates the plurality of wiring candidates. Furthermore, the quality rating unit rates the generated wiring candidates and selects the best wiring candidate.
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申请公布号 |
US6245599(B1) |
申请公布日期 |
2001.06.12 |
申请号 |
US19990456508 |
申请日期 |
1999.12.08 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
GOTO AKIHIRO;KAWAGUCHI HIROCHIKA;TAKAHASHI YOSHIHARU;TAKAHASHI TAKAO;ARITA TAKASHI;OOKYUU SATOSHI;TAKI HIROKAZU |
分类号 |
H01L23/12;G06F17/50;H01L21/82;H01L23/498;(IPC1-7):H01L21/66;H01L21/00;H01L21/44;H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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