| 摘要 |
PROBLEM TO BE SOLVED: To realize a stable mounting state of a board and improve reliability, by providing a pin member in a through hole of a board and cancelling a warp in the board and a mother board. SOLUTION: An electronic circuit mounted on the board 1 is connected to an electrode 4 in each through hole 2. Solder 7 and the pin member 8 are provided in the though hole 6 of each electrode 4. When the board 1 is mounted, the pin member 8 in a free state by soldering the solder 7 is dislocated downward and fitted to a land 10 on the mother board 9. The solder 7 melted and dropped from the through hole 6 is guided by the pin member 8 onto the land 10 to join the electrode 4 and the land 10 by the solder 7 and the pin member 8. Even when there is a warp in the board 1 or in the mother board 9, the warp can be cancelled by the pin member 8, and the board 1 can be mounted steadily on the mother board 9.
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