发明名称 |
Plasma processing apparatus |
摘要 |
A plasma processing apparatus has a processing chamber in which are provided one or more radio frequency antennas and a grounded opposite electrode positioned opposite to a sample. The radio frequency antenna 7 is formed of a material having no more than {fraction (1/100)} the volume resistivity of a material forming the opposite electrode. The radio frequency antenna may be buried in the opposite electrode, with its surface partially exposed to the plasma. Thus, the apparatus can have an enhanced processing rate and also provide a uniform process.
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申请公布号 |
US6244211(B1) |
申请公布日期 |
2001.06.12 |
申请号 |
US19990437732 |
申请日期 |
1999.11.10 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NISHIKAWA KAZUYASU;OOMORI TATSUO;OOTERA HIROKI |
分类号 |
H01L21/302;C23C16/44;H01J37/32;H01L21/3065;H01L21/31;(IPC1-7):C23C16/00 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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