发明名称 Plasma processing apparatus
摘要 A plasma processing apparatus has a processing chamber in which are provided one or more radio frequency antennas and a grounded opposite electrode positioned opposite to a sample. The radio frequency antenna 7 is formed of a material having no more than {fraction (1/100)} the volume resistivity of a material forming the opposite electrode. The radio frequency antenna may be buried in the opposite electrode, with its surface partially exposed to the plasma. Thus, the apparatus can have an enhanced processing rate and also provide a uniform process.
申请公布号 US6244211(B1) 申请公布日期 2001.06.12
申请号 US19990437732 申请日期 1999.11.10
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 NISHIKAWA KAZUYASU;OOMORI TATSUO;OOTERA HIROKI
分类号 H01L21/302;C23C16/44;H01J37/32;H01L21/3065;H01L21/31;(IPC1-7):C23C16/00 主分类号 H01L21/302
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