| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive package for a semiconductor laser module with high heat dissipation whose optical axis can be prevented from being shifted, or whose molding and assembly can be simplified. SOLUTION: This method for manufacturing a package for a semiconductor laser module comprises a process for forming mixed materials obtained by adding binder with copper powder and tungsten powder like the shape of a prescribed bottom plate 25 by a metallic powder injection molding(MIM), a frame body forming process for forming mixed materials obtained by adding binder to Kovar powder like the shape of a prescribed frame body 21 by the metallic powder injection molding(MIM), a process for connecting a bottom plate 25 formed by the bottom plate forming process with a frame body 21 formed by the frame body forming process, and a sintering process for sintering and unifying the connected bottom plate 25 and frame body 21.
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