| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit substrate which reduces EMI noise emitted from above the circuit substrate and reduces noise intermixes from outside. SOLUTION: A circuit substrate 10 provided with electrical components on the surface or reverse side thereof, comprises a ground layer 12 on the surface and a ground layer 14 on the reverse. Further, signal layers 18, 22 are located between the ground layers 12, 14.</p> |
