摘要 |
In a semiconductor package comprising a heat spreader, a heat sink, a wiring board, and a connector, a heat spreader is mounted on a remaining r egion of the upper surface of a substrate. The heat sink is thermally connected t o a primary integrated circuit chip through the heat spreader, and to a secondar y integrated circuit chip. The heat sink has electrical conductivity. The he at sink comprises a base plate and at least one connecting member which perpendicula rly extends from the base plate. The wiring board has a plurality of contact ho les and a plurality of contact slits. The connector is mounted on the wiring board, and has a plurality of contacts. The contacts are comprised of a plurality of socke t portions and a plurality of terminal portions. The contacts are connected to input/o utput pins, with the input/output pins inserted into the respective socket portions, and with the terminal portions inserted into the respective contact holes. The connector has at least one ground contact. The ground contact comprises a ground socket port ion and a ground terminal portion. The at least one ground contact is electrica lly connected to the at least one connecting member, with the connecting member inserted into the ground socket portion. The ground terminal portions are i nserted into the contact slits.
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申请人 |
JAPAN AVIATION ELECTRONICS INDUSTRY LIMITED;NEC CORPORATION |
发明人 |
SANO, TOSHIFUMI;YAMADA, MASAHIRO;NATORI, AKIRA;UMEZAWA, YOSHIAKI;OKADA, YOSHIKATSU |